Sony H266 with Snapdragon 845chipset revealed on Geekbench

Sony H8266A latest device Sony H266 spotted on Geekbench and hence the screenshot of the listing revealed. According to the Geekbench listing, the device Sony H266 will come with a full HD resolution display, 4GB RAM. It will be powered by Snapdragon 845 chipset and will run on Android 8.0 Oreo and will feature Bluetooth 5.0. It has scored 2393 in the single-core test, and 8300 in the multi-core test. Some of the models including Sony H8216, H8266, H8276, H8324 , H8541 and H296 have already leaked on the web and are liked to be announced soon. There is expectation that the device Sony H266 will be announced on Mobile World Congress (MWC) 2018 exhibition in February.

Also recently, the specifications of the device Sony Xperia XZ2 leaked. Now the leaked renders of the device Sony Xperia XZ2 revealed that it will come with bezel-less design. The image showed that the device will have the power button on the side with the fingerprint scanner. It will also come with a volume rocker and dedicated camera button on the right side.

According to the latest rumor, the device Sony Xperia XZ2 will come with the dimension of 148 x 73.4 x 7.4mm and weigh 156 grams. It will have IP68/65 rating. The device will come with a 5.48-inch display with full HD resolution of 1920 x 1080 pixels. It will have dual-SIM functionality ad will run on Android 8.1 Oreo.
It will feature a rear dual camera setup of 12MP and a front-facing camera of 15MP.  It will be powered by a 3,130mAh battery which will support Quick Charge.

The device Sony Xperia XZ1 will be the predecessor of Sony Xperia XZ2 that was launched in September, 2017. It comes with 5.2-inch (1920 x 1080 pixels) HDR TRILUMINOS Display with X-Reality and Corning Gorilla Glass 5 protection, 4GB RAM, 64GB internal memory, expandable memory up to 256GB with microSD card. It is powered by Octa-Core Snapdragon 835 Mobile Processor with Adreno 540 GPU and runs on Android 8.0 (Oreo). It has Water Resistant (IP65/IP68) body and has dual-SIM functionality. It has the dimension of 156 x 77 x 7.9 mm and weighs 155g.

It has 19MP rear camera with Exmos RS sensor, 1/2.3″ sensor, f/2.0 lens, Predictive capture, 5-axis stabilization, 4K video recording, 960fps slow-motion video and a front-facing camera of 13MP with 1/3″ Exmor RS sensor, 22mm wide-angle f/2.0 lens, 1080p video recording. It comes with 3D creator app that lets you capture in 3D and turn people and objects into high-resolution 3D avatars. It also supports DSEE HX, LDAC, Digital Noise Cancelling features.

Connectivity wise, it features 4G VoLTE, WiFi 802.11 ac (2.4GHz / 5GHz) MIMO, Bluetooth 5.0, GPS/ GLONASS, NFC, USB 3.1 Type-C and it is powered by 2700mAh battery with Qnovo Adaptive Charging.


Proceed with us for more information.

Leave a Reply