Xiaomi Helium leaked on Geekbench with Snapdragon 617 processor, 3GB RAM

xiaomi-heliumA latest affordable device Xiaomi Helium showed its presence on Geekbench with leaked specifications. According to the listing, the upcoming device Xiaomi Helium will feature 3GB RAM. It will be powered by Snapdragon 617 chipset with octa-core processor of 1.40 GHz and runs on Android Nougat 7.1.2. Except these, the listing didn’t reveal much detail related to it.

Also for your information, the other device Xiaomi Chiron is likely to be announced on 25th July, 2017, as its specification leaked on the web.
The device Xiaomi Chiron will feature Japanese Display International (JDI, a partnership between Sony, Toshiba and Hitachi) full active 6-inch display with non-existent bezels, 18:9 ratio and a resolution of 2160 x 1080 pixels with 2.5D curved glass on top. The leaked image of the device showed the display with thin bezels at the top and bottom edges. The front camera of the device can be seen at the top right of the device.
According to the latest rumor, the device Xiaomi Chiron will feature 6GB RAM, internal storage capacity of 128GB. It will be powered by a Qualcomm Snapdragon 835 chipset. There is also expectation that it will come with another version of 8GB of RAM and 256GB storage capacity. The device will include a dual rear camera of 12MP and a front-facing camera of 8MP.


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