LeEco Le 2s back panel images leaked

le eco 1The Chinese smartphone manufacturer LeEco is likely to announce its latest high –end device LeEco Le 2s in the first week of September, 2016. It has already leaked a couple of front images of the upcoming device. Now the back panel images of the device revealed that the device will have full metallic body, it also showed the LED flash and a fingerprint scanner just below its camera. The other image unveils an antenna band design, which will be similar to the upcoming iPhone 7 and iPhone 7 Plus.
le eco2There is expectation that it will be launched different hardware versions. The higher model will be powered by the Qualcomm Snapdragon 821 chipset and a massive 8GB of RAM while the lower version of the device will sport a display of 5.5” with the resolution of 1090pixels, 4GB of RAM, 32GB of storage capacity. It will be powered by the Snapdragon 820chipse and runs on Android 6.0.1 Marshmallow underneath LeEco’s own EUI. t. The camera section of the device will include rear camera of 16MP and front-facing camera of 8MP.

For more details we have to wait for few more days.


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