Yesterday , a couple of video teaser of Xiaomi Redmi Pro revealed that the device Xiaomi Redmi Pro will come with an OLED display and also added that it will be powered by a deca-core processor and feature a dual camera setup.
Now the company’s co-founder and CEO Lei Jun confirmed that the upcoming Xiaomi Redmi Pro will be the flagship device for Redmi series which will be powered by Deca-Core MediaTek Helio X25 SoC chipset. The latest teaser unveiled the brushed metal body of the device.
It is expected that Xiaomi Redmi Pro will sport Full HD OLED display of 5.5” with the resolution of 1920 x 1080pixels from AUO, internal storage capacity of 4GB / 6GB RAM, 64GB / 128GB .It will be powered by Deca-Core MediaTek Helio X25 processor with Mali-T880 MP4 GPU and runs on Android 6.0 Marshmallow with MIUI 8. It will support Fingerprint sensor and dual-SIM functionality.
The device will include a rear camera of 12 MP with Sony’s IMX260 and ISOCELL S5K2L1 sensor. It will be powered by 3,700mAh battery.
Connectivitywise, the device will feature 4G VoLTE, Wi-Fi 802.11 ac/b/g/n (2.4 / 5GHz), Bluetooth 4.1, GPS + GLONASS.
The device Xiaomi Redmi Pro will be announced on 27th July, 2016 at China National Convention Center in Beijing.
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