Xiaomi Mi Max specifications leaked via TENAA

Xiaomi-Mi-Max-Recently Xiaomi officially confirmed that the upcoming device Xiaomi Max will be announced at Beijing National Convention Center on 10th May, 2016 and now the device showed its presence on TENAA and revealed its images along with specifications. The leaked image of the phablet Xiaomi Mi Max showed its metallic body. The volume rockers and the power button are situated on its right side.
The upcoming device Xiaomi Mi Max will come with curved glass screen on its front side, a fingerprint sensor on its back side. The device will be available in two versions.
The rumored specification of the phablet will sport Full HD IPS display of 6.4” with the resolutions of 1920 x 1080 pixels, 2GB RAM with 16GB storage / 3GB RAM with 32GB storage, expandable memory with microSD and weight with 200grams. It will be powered by 64-bit Hexa-Core Snapdragon 650 chipset with 1.4GHz ARM A53 and 1.8 GHz ARM A72 processor with Adreno 510 GPU. The device will run on Android 6.0 (Marshmallow) based on MIUI 8.
The camera section of the device will include a rear camera of 16MP with dual-tone LED Flash and front-facing camera of 5MP. It will come with Dual SIM functionality.
Connectivity wise, the device will support 4G LTE with VoLTE, Wi-Fi 802.11ac (2.4 / 5GHz), Bluetooth 4.1, GPS and GLONASS.
It will be powered by a battery of 4000mAh. It is expected that the users will get 2GB RAM model of the device Xiaomi Mi Max at the cost of $199 (CNY 1299).

All the information of the device will be confirmed on 10th May, 2016.So we have to wait no more days.

 

Go ahead with us for more information.

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