LeEco Le 2 specs leaked via GFXBench, coming with Helio X25 Deca-Core SoC

LeEco-Le-2Recently, the detailed specifications of the upcoming device LeEco Le 2 Pro leaked via retail box. Now the upcoming device showed it’s presence on GFXBench and revealed some of its specifications. As we know it is the same Chinese smartphone manufacturer LeEco, which was formerly known as LeTV.

According to the GFXBench listing, the upcoming device LeEco Le 2 will sport full HD display of 5.5” with the resolution of 1080×1920 pixels, a pixel density of 401ppi, 3GB of RAM, internal storage capacity of 32GB, which can be further expanded via a microSD card slot.
It will be powered by MediaTek MT6797T Helio X25 deca-core SoC chipset of 2.0GHz coupled with Mali-T880 GPU and will run on Android 6.0 Marshmallow based customized eUI. It supports dual –SIM dual standby. The device will also include a fingerprint sensor for security purpose.
The camera section of the device will include a 16MP autofocus rear camera with LED flash, 4K video recording support and a front-facing camera of 8MP.
Connectivity wise, it will support 4G-LTE, Wi-Fi, Bluetooth, GPS and USB Type-C port.

There is also expectation that the higher version of the LeEco Le 2 namely LeEco Le 2 Pro with better specifications will be launched at the same day.

Since the information is not officially confirmed by the manufacturer LeEco, so don’t take it as confirmed.

The cost as well as its launching date is still unknown, but it is expected that it will be declared soon.


Proceed with us for more information.

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