Le Max Pro coming with Snapdragon 820 chicpset

Le Max Pro

LeTV officially announced the Le Max Pro at CES 2016 event where it is declared by Qualcomm that it will be the smartphone which will be powered by Snapdragon 820 quad-core processor.

Now the device approaching one step more towards its launching after getting the TENAA certification.

The smartphone will have a 6.33-inch (2560×1440 pixels) 2K display with latest Corning Gorilla Glass protection.  The smartphone will run on latest Android 6.0 Marshmallow.

It is noted that the LeTV Le Max Pro will also be the first device to feature Qualcomm Sense ID fingerprint technology that can offer more security to the smartphone. The Ultrasonic-based Sense ID can also detect whether it is a live finger or not and can provide more accurate results.

In the rear side of the smartphone it will have a 21MP camera with OIS dual LED flash and an Ultrapixel front-facing shooter for selfie lovers. Connectivity wise the smartphone it has 4G-LTE, Wi-Fi, GPS/A-GPS, Bluetooth 4.2, NFC and USB Type-C port. The smartphone will also be equipped with latest 802.11ad multi-gigabit Wi-Fi and X12 LTE with Cat 12/13 supporting download speeds up to 600Mbps. The smartphone will have also 4GB RAM, 32GB/64GB/128GB of internal storage that can be expanded further via microSD card slot. The smartphone equips with dual SIM dual standby and a 3400mAh battery and will also support Quick Charge 2.0.

Beside the Snapdragon 820 chipset, nothing has been confirmed by the company.

It is expected that the device will be available at the cost of $535 but the date of its launching is not confirmed yet.

But it is expected that the smartphone will be available in the first half of 2016.

Proceed with us for more information.

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