Now once again the images of the upcoming fourth generation of Moto X showed its appearance on the web with few details about the internal structure of the device. It is expected that the device will come with metallic frame and also the company has introduced Heat pipe cooling technology. According to the technology, a heat pipe will be used to keep the chipset cool during the processing. Since the devices like Microsoft Lumia 950 XL and Sony Xperia Z5 Premium already used such technology to control the overheating of the Snapdragon 810 SoC chipset.
The image also revealed that the inner side of the device will come with metal unibody. The previous leaked images as well as this one confirm the exact same location of both the camera and the speaker.
All the information related to the device will be confirmed in coming days.
Proceed with us for more information.